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照明用LED封装 设计、制造和测试 英文PDF|Epub|txt|kindle电子书版本网盘下载

照明用LED封装 设计、制造和测试 英文
  • 刘胜,罗小兵著 著
  • 出版社: 北京:化学工业出版社
  • ISBN:7122066299
  • 出版时间:2011
  • 标注页数:352页
  • 文件大小:55MB
  • 文件页数:371页
  • 主题词:

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图书目录

1 Introduction1

1.1 Historical Evolution of Lighting Technology1

1.2 Development of LEDs2

1.3 Basic Physics of LEDs6

1.3.1 Materials6

1.3.2 Electrical and Optical Properties10

1.3.3 Mechanical and Thermal Properties18

1.4 Industrial Chain of LED19

1.4.1 LED Upstream Industry21

1.4.2 LED Midstream Industry22

1.4.3 LED Downstream Industry22

1.5 Summary28

References29

2 Fundamentals and Development Trends of High Power LED Packaging33

2.1 Brief Introduction to Electronic Packaging33

2.1.1 About Electronic Packaging and Its Evolution33

2.1.2 Wafer Level Packaging,More than Moore,and SiP36

2.2 LED Chips37

2.2.1 Current Spreading Efficiency37

2.2.2 Internal Quantum Efficiency41

2.2.3 High Light Extraction Efficiency43

2.3 Types and Functions of LED Packaging48

2.3.1 Low Power LED Packaging49

2.3.2 High Power LED Packaging50

2.4 Key Factors and System Design of High Power LED Packaging51

2.5 Development Trends and Roadmap57

2.5.1 Technology Needs57

2.5.2 Packaging Types59

2.6 Summary62

References62

3 Optical Design of High Power LED Packaging Module67

3.1 Properties of LED Light67

3.1.1 Light Frequency and Wavelength67

3.1.2 Spectral Distribution69

3.1.3 Flux of Light69

3.1.4 Lumen Efficiency71

3.1.5 Luminous Intensity,Illuminance and Luminance71

3.1.6 Color Temperature,Correlated Color Temperature and Color Rendering Index76

3.1.7 White Light LED80

3.2 Key Components and Packaging Processes for Optical Design83

3.2.1 Chip Types and Bonding Process83

3.2.2 Phosphor Materials and Phosphor Coating Processes85

3.2.3 Lens and Molding Process90

3.3 Light Extraction93

3.4 Optical Modeling and Simulation98

3.4.1 Chip Modeling98

3.4.2 Phosphor Modeling102

3.5 Phosphor for White LED Packaging108

3.5.1 Phosphor Location for White LED Packaging108

3.5.2 Phosphor Thickness and Concentration for White LED Packaging118

3.5.3 Phosphor for Spatial Color Distribution123

3.6 Collaborative Design129

3.6.1 Co-design of Surface Micro-Structures of LED Chips and Packages129

3.6.2 Application Specific LED Packages134

3.7 Summary144

References144

4 Thermal Management of High Power LED Packaging Module149

4.1 Basic Concepts of Heat Transfer149

4.1.1 Conduction Heat Transfer150

4.1.2 Convection Heat Transfer150

4.1.3 Thermal Radiation151

4.1.4 Thermal Resistance153

4.2 Thermal Resistance Analysis of Typical LED Packaging154

4.3 Various LED Packages for Decreasing Thermal Resistance156

4.3.1 Development of LED Packaging156

4.3.2 Thermal Resistance Decrease for LED Packaging158

4.3.3 SiP/COB LED Chip Packaging Process162

4.4 Summary164

References164

5 Reliability Engineering of High Power LED Packaging167

5.1 Concept of Design for Reliability(DfR)and Reliability Engineering167

5.1.1 Fundamentals of Reliability168

5.1.2 Life Distribution169

5.1.3 Accelerated Models172

5.1.4 Applied Mechanics175

5.2 High Power LED Packaging Reliability Test179

5.2.1 Traditional Testing Standards,Methods,and Evaluation179

5.2.2 Methods for Failure Mechanism Analysis182

5.2.3 Failure Mechanisms Analysis184

5.3 Rapid Reliability Evaluation187

5.3.1 Material Property Database190

5.3.2 Numerical Modeling and Simulation194

5.4 Summary211

References211

6 Design of LED Packaging Applications215

6.1 Optical Design215

6.1.1 Introduction of Light Control215

6.1.2 Reflectors220

6.1.3 Lenses232

6.1.4 Diffuser272

6.1.5 Color Design and Control in LED Applications277

6.2 Thermal Management287

6.2.1 Analysis of System Thermal Resistance287

6.2.2 Types of Heat Dissipation to Environment293

6.2.3 Design and Optimization of Fin Heat Sink298

6.2.4 Design Examples of Thermal Management of Typical LED Lighting Systems303

6.3 Drive Circuit and Intelligent Control Design311

6.3.1 Typical LED Wireless Intelligent Control System311

6.3.2 Working Principles of Wireless Intelligent Control System312

6.4 Summary313

References313

7 LED Measurement and Standards317

7.1 Review of Measurement for LED Light Source317

7.2 Luminous Flux and Radiant Flux318

7.3 Measurement for Luminous Intensity319

7.4 LED Chromaticity Coordinates320

7.5 Dominant Wavelength Determination Algorithm321

7.5.1 Curve Fitting Method321

7.6 LED Color Purity322

7.7 Color Temperature and Correlated Color Temperature of Light Source323

7.8 Automatic Sorting for LEDs324

7.9 Measurement for LED Road Lights325

7.9.1 Electrical Characteristics325

7.9.2 Color Characteristics326

7.9.3 Light Distribution Characteristics326

7.9.4 Dynamic Characteristics326

7.9.5 Test of Reliability329

7.10 Summary329

References329

Appendix:Measurement Method for Integral LED Road Lights Approved by China Solid State Lighting Alliance331

Index349

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